ElektroPhysik - Advancing with Technology

MiniTest 7x0

The new MiniTest 700 series integrates the digital signal processing at the first time inside the sensor of a coating thickness gauge. This technology goes beyond the limits caused by the conventional analog technology and a new benchmark is set in the coating thickness measurement.

The new SIDSP technology was developed inside the development laboratories of ElektroPysik and new market ready products are the first result. SIDSP stands for "sensor integrated digital signal processing" and this means, that the sensor head contains a digital signal processor which is responsible for data  acquisition, filtering and conditioning nearby the sensor tip and a simultaneous disturbance detection and suppression. This isn't possible with the traditional analog technology. More...